Imagine the lego bricks in the video banner above as LED packages.

With conventional Surface Mount Device (SMD) technology, each LED chip is encapsulated in a package.

Each package has 4 pins and is attached to a printed circuit board. Each single pin is vulnerable to humidity and vibrations. The moisture in an SMD package can damage the optical characteristics of LEDs.

With Chip-On-Board (COB) nanotechnology, LED chips can be attached directly on a substrate without using packages. The result is dramatically increased reliability and functionality.

By smart design of UVC LED arrays in a box, its content can be optimally irradiated from all angles. With a little imagination, one can also see the lego bricks in the video banner as bacteria and viruses being eliminated from the surface or packaging of a product by UVC light.

The latest innovation by COBstr is the implementation and design of 1 proprietary driver IC per LED bead, as opposed to 1 driver IC per multitude of LEDs. This technology is at the heart of an ultra thin (1 mm) LED foil that can be laminated in glass.

Y.C. Lo, former Executive Vice-President of Royal Philips, understood the disruptive nature of Chip-On-Board technology early on and wholeheartedly supported the COBstr venture.